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PRODUCT DETAIL · PI-0017
Product DetailsMS-PA100/200
PI-0017 · MS-PA100/200PI-0017 · Pre & Post - treatment Chemicals / Etchant
PRODUCT · PI-0017
MS-PA100/200
EtchantProduct Features
Cleans the material without other damage, and the activation is uniform. Solder spreadability is improved after treatment.The occurrence of sludge is low.
PRODUCT SPECIFICATION · PI-0017
MS-PA100/200
Pre & Post - treatment Chemicals / EtchantProduct Information
- Product ID
- PI-0017
- Features
- Cleans the material without other damage, and the activation is uniform. Solder spreadability is improved after treatment. The occurrence of sludge is low.
- Applicable Materials
- Copper/copper alloy (C7025), STS, nickel, Alloy42 for lead frame
RELATED PROCESS