Can be used at higher current densities compared to Watt bath, and the plating speed can be more than twice as fast. Uniform deposition and corrosion resistance are excellent.(In a Watt bath with common organic additives, uniform deposition is poor, and plating in deep recesses is uneven.) Low deposition stress provides rich ductility, making it easy to process, and mechanical properties are excellent. High surface activity of the deposited layer makes it suitable for double nickel plating.
Can be used at higher current densities compared to Watt bath, and the plating speed can be more than twice as fast. Uniform deposition and corrosion resistance are excellent. (In a Watt bath with common organic additives, uniform deposition is poor, and plating in deep recesses is uneven.) Low deposition stress provides rich ductility, making it easy to process, and mechanical properties are excellent. High surface activity of the deposited layer makes it suitable for double nickel plating.