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PRODUCT DETAIL · PI-0050
Product DetailsAUROLESS 311
PI-0050 · AUROLESS 311PI-0050 · Plating Solutions / Electroless Gold
PRODUCT · PI-0050
AUROLESS 311
Electroless GoldProduct Features
It is a strongly alkaline cyanide-type reduction-type electroless gold plating bath. Thickness gold plating is possible.Formation of gold plating film with excellent selective deposition is possible. A deposition rate of about 6 μm/hour can be achieved.Formation of gold plating film with excellent wire bonding characteristics is possible. The bath has excellent stability and can be used up to 1.5~2.0 MTO.
PRODUCT SPECIFICATION · PI-0050
AUROLESS 311
Plating Solutions / Electroless GoldProduct Information
- Product ID
- PI-0050
- Product Group
- Electroless Gold ↗Electroless Gold ↗
- Features
- It is a strongly alkaline cyanide-type reduction-type electroless gold plating bath. Thickness gold plating is possible. Formation of gold plating film with excellent selective deposition is possible. A deposition rate of about 6 μm/hour can be achieved. Formation of gold plating film with excellent wire bonding characteristics is possible. The bath has excellent stability and can be used up to 1.5~2.0 MTO.
- Deposition Thickness / Time
- 0.80㎛ / 10min