It is a low-speed electroless copper plating solution used for the copper plating of through holes on printed circuit boards. It plates to a uniform thickness (0.3~0.5 µm) with perfect coverage to provide a uniform conductive plating film.
It is a low-speed electroless copper plating solution used for the copper plating of through holes on printed circuit boards. It plates to a uniform thickness (0.3~0.5 µm) with perfect coverage to provide a uniform conductive plating film.