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PRODUCT DETAIL · PI-0074
Product DetailsMS-LSM
PI-0074 · MS-LSMPI-0074 · Plating Solutions / Tin & Tin Alloys – Sn / Sn-Pb / Sn-Bi
PRODUCT · PI-0074
MS-LSM
Tin & Tin Alloys – Sn / Sn-Pb / Sn-BiProduct Features
It can be applied to a wide range, such as organic acid baths and sulfuric acid baths. Uniform plating can be obtained even at a wide range of current densities.It is designed to be suitable for barrel and rack plating. It is suitable for matte or semi-bright pure tin plating.Whisker formation is minimized. Plating with a low carbon content can be obtained.Plating with excellent solderability can be achieved. It is widely used for electronic component plating.
PRODUCT SPECIFICATION · PI-0074
MS-LSM
Plating Solutions / Tin & Tin Alloys – Sn / Sn-Pb / Sn-BiProduct Information
- Product ID
- PI-0074
- Features
- It can be applied to a wide range, such as organic acid baths and sulfuric acid baths. Uniform plating can be obtained even at a wide range of current densities. It is designed to be suitable for barrel and rack plating. It is suitable for matte or semi-bright pure tin plating. Whisker formation is minimized. Plating with a low carbon content can be obtained. Plating with excellent solderability can be achieved. It is widely used for electronic component plating.
- Scope of Application
- For electronic components, Pure Tin