PI-0076 · MS-MSMPI-0076 · Plating Solutions / Tin & Tin Alloys – Sn / Sn-Pb / Sn-Bi
PRODUCT · PI-0076
MS-MSM
Tin & Tin Alloys – Sn / Sn-Pb / Sn-Bi
Product Features
It can be applied to a wide range including organic acid baths and sulfuric acid baths. Uniform plating can be obtained even at a wide range of current densities.It is designed to be suitable for the low current of Barrel and Rack plating. It is suitable for semi-bright pure tin and tin-lead plating from 97:3 to 60:40.It can be used for etching resist plating in PCB pattern processes.
PRODUCT SPECIFICATION · PI-0076
MS-MSM
Plating Solutions / Tin & Tin Alloys – Sn / Sn-Pb / Sn-Bi
It can be applied to a wide range including organic acid baths and sulfuric acid baths. Uniform plating can be obtained even at a wide range of current densities. It is designed to be suitable for the low current of Barrel and Rack plating. It is suitable for semi-bright pure tin and tin-lead plating from 97:3 to 60:40. It can be used for etching resist plating in PCB pattern processes.
Scope of Application
For electronic components, PCB Metal Etching Resist.