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PRODUCT DETAIL · PI-0083
Product DetailsMS-AG118A
PI-0083 · MS-AG118API-0083 · Plating Solutions / Tin Alloys – Sn-Ag / Sn-Cu / Sn-Au
PRODUCT · PI-0083
MS-AG118A
Tin Alloys – Sn-Ag / Sn-Cu / Sn-AuProduct Features
It is an additive for Sn/Ag alloy plating baths for low-speed and high-speed use.
PRODUCT SPECIFICATION · PI-0083
MS-AG118A
Plating Solutions / Tin Alloys – Sn-Ag / Sn-Cu / Sn-AuProduct Information
- Product ID
- PI-0083
- Features
- It is an additive for Sn/Ag alloy plating baths for low-speed and high-speed use.
- Scope of Application
- Wafer Bump, PCB