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TECHNOLOGY · 2025. 03. 27

Localization and technological independence of import-dependent surface-treatment chemicalsLocalization and technological independence of import-dependent surface-treatment chemicals

Introducing domestic achievements in the surface treatment field such as semiconductor package post-processing process materials and plating baths for wafer bumps.Introducing domestic achievements in the surface treatment field such as semiconductor package post-processing process materials and plating baths for wafer bumps.

NewsLocalization and technological independence of import-dependent surface-treatment chemicals
2025. 03. 27

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Localization and technological independence of import-dependent surface-treatment chemicals representative image

The report introduced MSC's research and development direction, which has shifted chemical materials for semiconductor package post-processing, previously highly dependent on overseas sources, to domestic technology.

The core content includes the technology accumulated in the field of electronic component surface treatment, including the plating baths used in semiconductor package post-processing and wafer bump processes, as well as domestic production achievements.

The application range and process suitability of detailed products cannot be determined by public articles alone, and MSC technology inquiries must be made before actual application.

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