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PROCESS DETAIL · AP-006
Process DetailElectroless Plating Process for Mo (Molybdenum) Coatings
AP-006 · Electroless Plating Process for Mo (Molybdenum) CoatingsAP-006 · Electronics · Circuit
PROCESS INFORMATION · AP-006
Electroless Plating Process for Mo (Molybdenum) Coatings
Electronics · Circuit- Process ID
- AP-006
- Process Categories
- Electronics · Circuit
- Applications
- Molybdenum (Mo) and alloys
- Related Industries
- Semiconductor
Process Sequence
6 steps
| Process order | Process Name | Process Description | Recommended product |
|---|---|---|---|
| 1 | Alkaline ultrasonic degreasing | Remove surface contaminants | Above 60℃ for 5 minutes |
| 2 | Alkaline activation | Impart roughness and remove adhesion foreign substances | MS-ACT500 · Refer to handling manual |
| 3 | Acid activation | — | Hydrochloric acid 50% |
| 4 | Catalyst treatment | Apply palladium catalyst | MS-Pd200 |
| 5 | Acid cleaning | Catalyst activation | Hydrochloric acid 30% |
| 6 | Electroless nickel plating | — | Refer to handling manual |
Pre-treatment
Material preparation
- STEP1
Alkaline ultrasonic degreasing
Remove surface contaminants
Recommended productMS-A CLEAN↗Above 60℃ for 5 minutes
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