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PRODUCT DETAIL · PI-0033
Product DetailsMS-211
PI-0033 · MS-211PI-0033 · Plating Solutions / Electroless Nickel
PRODUCT · PI-0033
MS-211
Electroless NickelPRODUCT SPECIFICATION · PI-0033
MS-211
Plating Solutions / Electroless NickelProduct Information
- Product ID
- PI-0033
- Product Group
- Electroless Nickel ↗Electroless Nickel ↗
- pH
- 4.5–5.0
- Rate (㎛)
- 14–19
- Chemical composition
- M, A, B, C
- Temperature (℃)
- 83–90
- Phosphorus (P) · alloy
- P 7–9%
RELATED PROCESS
Connection processRelated Processes
Electroless Plating Process for Mo (Molybdenum) CoatingsView process details →Electroless Plating Process for Mo (Molybdenum) CoatingsAP-006 →Plating process of aluminum materialView process details →Plating process of aluminum materialAP-008 →MSC Electroless Nickel Process GuideView process details →MSC Electroless Nickel Process GuideAP-014 →