Skip to main contentProduct Inquiry →
PRODUCT DETAIL · PI-0014
Product DetailsAT-153(Cu)
PI-0014 · AT-153(Cu)PI-0014 · Pre & Post - treatment Chemicals / Activator
PRODUCT · PI-0014
AT-153(Cu)
ActivatorProduct Features
Uniformly etches the Cu (Copper) surface to activate and remove surface and inner-layer oxide films and scales formed during heat treatment, and also forms fine irregularities on the Cu surface to achieve plating with excellent covering and adhesion. It is a sulfuric acid/hydrogen peroxide type micro-etching solution.
PRODUCT SPECIFICATION · PI-0014
AT-153(Cu)
Pre & Post - treatment Chemicals / ActivatorProduct Information
- Product ID
- PI-0014
- Product Group
- Activator ↗Activator ↗
- Features
- Uniformly etches the Cu (Copper) surface to activate and remove surface and inner-layer oxide films and scales formed during heat treatment, and also forms fine irregularities on the Cu surface to achieve plating with excellent covering and adhesion. It is a sulfuric acid/hydrogen peroxide type micro-etching solution.
- Applicable Materials
- Copper and copper alloys