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PRODUCT DETAIL · PI-0021
Product DetailsMS-PC180
PI-0021 · MS-PC180PI-0021 · Pre & Post - treatment Chemicals / Etchant
PRODUCT · PI-0021
MS-PC180
EtchantProduct Features
Due to a stable etching rate, it can form uniform fine irregularities on the copper surface and achieve plating with excellent adhesion between copper surfaces. Depending on the analysis results of the solution, it can be replenished, and stable operation can continue for a long time without completely renewing the solution.When the copper concentration in the bath increases, part of the solution can be discarded, and a significant amount of pure water and chemicals can be replenished to continue use. It is effective for removing stains and fingerprints from the copper surface.
PRODUCT SPECIFICATION · PI-0021
MS-PC180
Pre & Post - treatment Chemicals / EtchantProduct Information
- Product ID
- PI-0021
- Features
- Due to a stable etching rate, it can form uniform fine irregularities on the copper surface and achieve plating with excellent adhesion between copper surfaces. Depending on the analysis results of the solution, it can be replenished, and stable operation can continue for a long time without completely renewing the solution. When the copper concentration in the bath increases, part of the solution can be discarded, and a significant amount of pure water and chemicals can be replenished to continue use. It is effective for removing stains and fingerprints from the copper surface.
- Applicable Materials
- Copper and Copper Alloys for PCB
RELATED PROCESS