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PROCESS DETAIL · AP-003
Process DetailPCB Final Finish ENIG Plating Process
AP-003 · PCB Final Finish ENIG plating processAP-003 · Electronics · Circuit
PROCESS INFORMATION · AP-003
PCB Final Finish ENIG Plating Process
Electronics · Circuit- Process ID
- AP-003
- Process Categories
- Electronics · Circuit
- Applications
- Printed circuit board copper pad
- Related Industries
- PCB
Process Sequence
13 steps
| Process order | Process Name | Process Description | Recommended product |
|---|---|---|---|
| 1 | Acid Clean | Acid Cleaning | |
| 2 | rinsing | — | — |
| 3 | Soft Etching | Formation of fine irregularities on copper surface | |
| 4 | rinsing | — | — |
| 5 | Acid Dip | Acid Immersion | — |
| 6 | rinsing | — | — |
| 7 | Catalyst | Apply Pd Catalyst | MS-ACT20 / MS-ACT100 |
| 8 | rinsing | — | — |
| 9 | E'less Nickel | Electroless nickel plating | |
| 10 | rinsing | — | — |
| 11 | Immersion Gold | Substituted type gold plating | |
| 12 | rinsing | — | — |
| 13 | Drying | — | — |
Pre-treatment
Material preparation
- STEP1
- 2rinsing
- STEP3
- 4rinsing
- STEP5
Acid Dip
Acid Immersion
- 6rinsing
RELATED PRODUCTS