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PRODUCT DETAIL · PI-0040
Product DetailsMS-811
PI-0040 · MS-811PI-0040 · Plating Solutions / Electroless Nickel
PRODUCT · PI-0040
MS-811
Electroless NickelProduct Features
Used for PCB, ceramics, semiconductors, and conductive patterns. It is a process for metallizing non-conductive PC material.Adhesion with PC material is better than with chemical copper.
PRODUCT SPECIFICATION · PI-0040
MS-811
Plating Solutions / Electroless NickelProduct Information
- Product ID
- PI-0040
- Product Group
- Electroless Nickel ↗Electroless Nickel ↗
- Features
- Used for PCB, ceramics, semiconductors, and conductive patterns. It is a process for metallizing non-conductive PC material. Adhesion with PC material is better than with chemical copper.
- pH
- 6.0–6.5
- Rate (㎛)
- 5–7
- Chemical composition
- A, B, C
- Temperature (℃)
- 28–38
- Phosphorus (P) · alloy
- B 1%
RELATED PROCESS