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PROCESS DETAIL · AP-013
Process DetailElectroless Plating Process on Fine Powder
AP-013 · Electroless Plating Process on Fine PowderAP-013 · Special shape · Function
PROCESS INFORMATION · AP-013
Electroless Plating Process on Fine Powder
Special Shape · Function- Process ID
- AP-013
- Process Categories
- Special Shape · Function
- Applications
- Ceramic, resin, and metal powders; CBN (diameter 1–200 μm)
- Related Industries
- Special · Functional
Process Sequence
13 steps
| Process order | Process Name | Process Description | Recommended product |
|---|---|---|---|
| 1 | Surface adjustment | — | MS Surface Modifier |
| 2 | rinsing | — | — |
| 3 | Etching | Applied separately by material | MS etching agent |
| 4 | rinsing | — | — |
| 5 | Conditioning | Applied separately by material | MS Conditioner |
| 6 | rinsing | — | — |
| 7 | Sensitizing or Activating | — | MS-ACT or SP-PD Process |
| 8 | rinsing | — | — |
| 9 | Accelerator | — | MS-ACT Process |
| 10 | rinsing | — | — |
| 11 | Electroless Plating | Precipitated Metal Selection: Ni-P / Ni-B / Ni-P-W / Ni-P-Co / Ag / Sn / Au / Cu | MS-511 · MS ENW · MS Ni-Co · Electrodeposited Tin/Lead · MS Cu-550 |
| 12 | rinsing | — | — |
| 13 | Drying | — | — |
Pre-treatment
Material preparation
- STEP1
Surface adjustment
Recommended productMS Surface Modifier - 2rinsing
- STEP3
Etching
Applied separately by material
Recommended productMS etching agent - 4rinsing
- STEP5
Conditioning
Applied separately by material
Recommended productMS Conditioner - 6rinsing
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