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PRODUCT DETAIL · PI-0062
Product DetailsMS-AG200
PI-0062 · MS-AG200PI-0062 · Plating Solutions / Electroless / Immersion Silver
PRODUCT · PI-0062
MS-AG200
Electroless / Immersion SilverProduct Features
Direct silver plating on copper circuits is possible. It contains no cyanide compounds, providing a good working environment and reducing wastewater treatment costs.It has excellent heat resistance and soldering reliability, especially maintaining properties after high-temperature treatment in Lead-Free solder. As an acidic type, it does not erode the resist film.
PRODUCT SPECIFICATION · PI-0062
MS-AG200
Plating Solutions / Electroless / Immersion SilverProduct Information
- Product ID
- PI-0062
- Features
- Direct silver plating on copper circuits is possible. It contains no cyanide compounds, providing a good working environment and reducing wastewater treatment costs. It has excellent heat resistance and soldering reliability, especially maintaining properties after high-temperature treatment in Lead-Free solder. As an acidic type, it does not erode the resist film.
- Scope of Application
- PCB and electronic components