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PRODUCT DETAIL · PI-0066
Product DetailsMS-TIN100
PI-0066 · MS-TIN100PI-0066 · Plating Solutions / Electroless / Immersion Tin
PRODUCT · PI-0066
MS-TIN100
Electroless / Immersion TinProduct Features
A dense and uniform coating is formed with a simple immersion process. It has a wide working temperature range and excellent solderability.It is a non-cyanide, non-fluoride type with excellent stability. Suitable for PCB and COF package plating.It is an organic acid type electroless tin plating bath.
PRODUCT SPECIFICATION · PI-0066
MS-TIN100
Plating Solutions / Electroless / Immersion TinProduct Information
- Product ID
- PI-0066
- Features
- A dense and uniform coating is formed with a simple immersion process. It has a wide working temperature range and excellent solderability. It is a non-cyanide, non-fluoride type with excellent stability. Suitable for PCB and COF package plating. It is an organic acid type electroless tin plating bath.
- Scope of Application
- Copper or copper alloy