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PRODUCT DETAIL · PI-0067
Product DetailsMS-NT500
PI-0067 · MS-NT500PI-0067 · Plating Solutions / Neutral Tin
PRODUCT · PI-0067
MS-NT500
Neutral TinProduct Features
Suitable as a barrel neutral tin plating bath, particularly for plating various chips such as MLCC and CR. Since halogen compounds are not used, chip corrosion is minimal.The plating particles are dense, providing excellent soldering characteristics and adhesion, and oxidation due to oxygen is low. With good throwing power, thickness variations in plating are minimal.Bubbles dissipate quickly, making it advantageous for equipment prone to bubble formation. It is a caustic soda type plating bath.
PRODUCT SPECIFICATION · PI-0067
MS-NT500
Plating Solutions / Neutral TinProduct Information
- Product ID
- PI-0067
- Product Group
- Neutral Tin ↗Neutral Tin ↗
- Features
- Suitable as a barrel neutral tin plating bath, particularly for plating various chips such as MLCC and CR. Since halogen compounds are not used, chip corrosion is minimal. The plating particles are dense, providing excellent soldering characteristics and adhesion, and oxidation due to oxygen is low. With good throwing power, thickness variations in plating are minimal. Bubbles dissipate quickly, making it advantageous for equipment prone to bubble formation. It is a caustic soda type plating bath.
- Scope of Application
- For chip plating such as MLCC, CR, etc.