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PRODUCT DETAIL · PI-0071
Product DetailsMS-HSM
PI-0071 · MS-HSMPI-0071 · Plating Solutions / Tin & Tin Alloys – Sn / Sn-Pb / Sn-Bi
PRODUCT · PI-0071
MS-HSM
Tin & Tin Alloys – Sn / Sn-Pb / Sn-BiProduct Features
Suitable for lead-free organic acid baths. Uniform plating can be achieved over a wide range of current densities.It is a pure tin semi-bright high-speed tin plating additive. Whisker formation has been minimized.Plating with excellent solderability can be obtained. Widely used for electronic component plating.
PRODUCT SPECIFICATION · PI-0071
MS-HSM
Plating Solutions / Tin & Tin Alloys – Sn / Sn-Pb / Sn-BiProduct Information
- Product ID
- PI-0071
- Features
- Suitable for lead-free organic acid baths. Uniform plating can be achieved over a wide range of current densities. It is a pure tin semi-bright high-speed tin plating additive. Whisker formation has been minimized. Plating with excellent solderability can be obtained. Widely used for electronic component plating.
- Scope of Application
- For I/C packages and electronic components