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PRODUCT DETAIL · PI-0073
Product DetailsMS-H30
PI-0073 · MS-H30PI-0073 · Plating Solutions / Tin & Tin Alloys – Sn / Sn-Pb / Sn-Bi
PRODUCT · PI-0073
MS-H30
Tin & Tin Alloys – Sn / Sn-Pb / Sn-BiProduct Features
Suitable for lead-free organic acid baths. Can achieve uniform plating over a wide range of current densities.Suitable for semi-bright pure tin plating. Minimized whisker formation.Can achieve low carbon concentration plating. Can achieve plating with excellent solderability characteristics.
PRODUCT SPECIFICATION · PI-0073
MS-H30
Plating Solutions / Tin & Tin Alloys – Sn / Sn-Pb / Sn-BiProduct Information
- Product ID
- PI-0073
- Features
- Suitable for lead-free organic acid baths. Can achieve uniform plating over a wide range of current densities. Suitable for semi-bright pure tin plating. Minimized whisker formation. Can achieve low carbon concentration plating. Can achieve plating with excellent solderability characteristics.
- Scope of Application
- For electronic components and wide strip plates