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PRODUCT DETAIL · PI-0077
Product DetailsMB-HSM
PI-0077 · MB-HSMPI-0077 · Plating Solutions / Tin & Tin Alloys – Sn / Sn-Pb / Sn-Bi
PRODUCT · PI-0077
MB-HSM
Tin & Tin Alloys – Sn / Sn-Pb / Sn-BiProduct Features
Can be applied to organic acid baths. Uniform plating can be obtained over a wide range of current densities.It is designed to be suitable for R-T-R and M-T-M plating. Suitable for semi-bright tin and Bi 98:2 plating.Enables fine-grain plating and minimizes whisker formation. Provides low carbon content plating.Produces plating with excellent solderability characteristics.
PRODUCT SPECIFICATION · PI-0077
MB-HSM
Plating Solutions / Tin & Tin Alloys – Sn / Sn-Pb / Sn-BiProduct Information
- Product ID
- PI-0077
- Features
- Can be applied to organic acid baths. Uniform plating can be obtained over a wide range of current densities. It is designed to be suitable for R-T-R and M-T-M plating. Suitable for semi-bright tin and Bi 98:2 plating. Enables fine-grain plating and minimizes whisker formation. Provides low carbon content plating. Produces plating with excellent solderability characteristics.
- Scope of Application
- For electronic components, lead-free