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PRODUCT DETAIL · PI-0084
Product DetailsMS-AG118B
PI-0084 · MS-AG118BPI-0084 · Plating Solutions / Tin Alloys – Sn-Ag / Sn-Cu / Sn-Au
PRODUCT · PI-0084
MS-AG118B
Tin Alloys – Sn-Ag / Sn-Cu / Sn-AuProduct Features
It is an additive for Sn/Ag alloy plating baths for low-speed and high-speed use.
PRODUCT SPECIFICATION · PI-0084
MS-AG118B
Plating Solutions / Tin Alloys – Sn-Ag / Sn-Cu / Sn-AuProduct Information
- Product ID
- PI-0084
- Features
- It is an additive for Sn/Ag alloy plating baths for low-speed and high-speed use.
- Scope of Application
- Wafer Bump, PCB