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PRODUCT DETAIL · PI-0104
Product DetailsMS-Pd150
PI-0104 · MS-Pd150PI-0104 · Pre & Post - treatment Chemicals / Specialty PCB Plating Additives
PRODUCT · PI-0104
MS-Pd150
Specialty PCB Plating AdditivesProduct Features
By dipping or spray-treating the substrate, palladium smuts can be removed in a short time. The pH of the treatment solution is slightly alkaline at about 9, and the copper dissolution amount can be suppressed to 0.05 μm or less.It is particularly effective for the pretreatment of electroless nickel plating on fine pattern substrates such as build-up. It is organic acid salt-based and of a single-bath type, making it easy to handle.Combining it with a dedicated acidic cleaning agent further enhances its effectiveness. In the plating process of various printed circuit boards (PCBs), this chemical dissolves and removes Pd smuts that remain after being generated on the insulating resin layer by an activator and are not removed in the copper etching process.This treatment can prevent the deposition of electroless nickel plating on the resin areas other than the patterns, resulting in a product with high reliability.
PRODUCT SPECIFICATION · PI-0104
MS-Pd150
Pre & Post - treatment Chemicals / Specialty PCB Plating AdditivesProduct Information
- Product ID
- PI-0104
- Features
- By dipping or spray-treating the substrate, palladium smuts can be removed in a short time. The pH of the treatment solution is slightly alkaline at about 9, and the copper dissolution amount can be suppressed to 0.05 μm or less. It is particularly effective for the pretreatment of electroless nickel plating on fine pattern substrates such as build-up. It is organic acid salt-based and of a single-bath type, making it easy to handle. Combining it with a dedicated acidic cleaning agent further enhances its effectiveness. In the plating process of various printed circuit boards (PCBs), this chemical dissolves and removes Pd smuts that remain after being generated on the insulating resin layer by an activator and are not removed in the copper etching process. This treatment can prevent the deposition of electroless nickel plating on the resin areas other than the patterns, resulting in a product with high reliability.
- Scope of Application
- For removing Pd Smut in PCB processes