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PRODUCT DETAIL · PI-0025
Product DetailsMS-C2300 (Colloid Type)
PI-0025 · MS-C2300 (Colloid Type)PI-0025 · Pre & Post - treatment Chemicals / Palladium Catalyst
PRODUCT · PI-0025
MS-C2300 (Colloid Type)
Palladium CatalystProduct Features
Adsorb a fine Sn/Pd colloid so that electroless copper plating particles can adhere to the surface of the defective substrate. The acid concentration is designed to be low to minimize the impact on the inner layers.The activity is designed to be high so as to have excellent adsorption to epoxy resin and glass fiber.
PRODUCT SPECIFICATION · PI-0025
MS-C2300 (Colloid Type)
Pre & Post - treatment Chemicals / Palladium CatalystProduct Information
- Product ID
- PI-0025
- Product Group
- Palladium Catalyst ↗Palladium Catalyst ↗
- Features
- Adsorb a fine Sn/Pd colloid so that electroless copper plating particles can adhere to the surface of the defective substrate. The acid concentration is designed to be low to minimize the impact on the inner layers. The activity is designed to be high so as to have excellent adsorption to epoxy resin and glass fiber.
- Applicable materials · scope
- PCB copper plating / PTH