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PRODUCT DETAIL · PI-0061
Product DetailsMS-AG100 (Pre-Dip)
PI-0061 · MS-AG100 (Pre-Dip)PI-0061 · Plating Solutions / Electroless / Immersion Silver
PRODUCT · PI-0061
MS-AG100 (Pre-Dip)
Electroless / Immersion SilverProduct Features
The bath stability is excellent. The uniformity of the plating film is excellent, and it can also be applied to copper materials and electroless nickel plating layers.Physical properties such as adhesion and bonding are good. It can be used as a substitute for electroless nickel/electroless gold plating on PCB substrates, and it is ideal for surface treatment of PCB substrates, reducing plating costs.
PRODUCT SPECIFICATION · PI-0061
MS-AG100 (Pre-Dip)
Plating Solutions / Electroless / Immersion SilverProduct Information
- Product ID
- PI-0061
- Features
- The bath stability is excellent. The uniformity of the plating film is excellent, and it can also be applied to copper materials and electroless nickel plating layers. Physical properties such as adhesion and bonding are good. It can be used as a substitute for electroless nickel/electroless gold plating on PCB substrates, and it is ideal for surface treatment of PCB substrates, reducing plating costs.
- Scope of Application
- PCB and electronic components