PI-0068 · MS-LSM350PI-0068 · Plating Solutions / Neutral Tin
PRODUCT · PI-0068
MS-LSM350
Neutral Tin
Product Features
Suitable as a neutral tin plating bath for barrels, especially for various chip plating such as MLCC, CR, etc. Since no halogen compounds are used, chip corrosion is minimal.The plating particles are dense, providing excellent soldering properties and adhesion, and oxidation by oxygen is minimal. Good throwing power results in minimal plating thickness variation.It is an ammonia-type plating bath.
Suitable as a neutral tin plating bath for barrels, especially for various chip plating such as MLCC, CR, etc. Since no halogen compounds are used, chip corrosion is minimal. The plating particles are dense, providing excellent soldering properties and adhesion, and oxidation by oxygen is minimal. Good throwing power results in minimal plating thickness variation. It is an ammonia-type plating bath.